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IR3537MTRPBF - Infineon

Description: Gate Drivers 12V HI EFFICIENCY MOSFET DRVR

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IR3537MTRPBF - Infineon PCB footprint - Other - Other - IR3537MTRPBF-1
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IR3537MTRPBF - Infineon  - 3D model - Other - IR3537MTRPBF-1
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IR3537MTRPBF Details

  • Manufacturer Part Number:

    IR3537MTRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DFN-10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-N10

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.85 mm

  • Supply Voltage-Max:

    13.2 V

  • Supply Voltage-Min:

    10.8 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    13.2 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

IR3537MTRPBF Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern under the device to ensure optimal thermal performance.
  • Ensure proper thermal management by providing adequate heat sinking, and consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • Infineon recommends using X7R or X5R ceramic capacitors with a voltage rating of 10V or higher for input and output capacitors, with a capacitance value of 4.7uF to 10uF.
  • Use a shielded enclosure, keep sensitive components away from the IR3537MTRPBF, and use a common-mode choke or ferrite bead to filter out high-frequency noise.
  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a cooling rate of 4°C/s to prevent thermal shock.

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IR3537MTRPBF Overview

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