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IR38060MTRPBF - Infineon

Description: 6A SupIRBuck Regulator with PMBus I/F Infineon, IR38060MTRPBF Step-Down Switching Regulator 6A Adjustable, 0.5 → 0.875 V dc, 35-Pin QFN

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PCB Footprints
IR38060MTRPBF - Infineon PCB footprint - Other - Other - QFN 5x6 mm
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IR38060MTRPBF - Infineon  - 3D model - Other - QFN 5x6 mm
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IR38060MTRPBF Details

  • Manufacturer Part Number:

    IR38060MTRPBF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    QFN-26

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    1.2 V

  • JESD-30 Code:

    R-XQCC-N26

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    26

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    6 A

  • Output Voltage-Max:

    14 V

  • Output Voltage-Min:

    0.5 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC26,.2X.25(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    40 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1650 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Width:

    5 mm

IR38060MTRPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (TJ) and adjust the design accordingly.
  • Critical components include the input capacitors, output inductors, and output capacitors. Ensure these components meet the recommended specifications and are properly sized for the application.
  • Use the device's low-power modes, such as burst mode or skip mode, and optimize the design for low quiescent current. Ensure the input voltage is within the recommended range and use low-power components.
  • Use a shielded layout, minimize loop areas, and use EMI filters or common-mode chokes as needed. Ensure the design meets the relevant EMI and EMC standards for the target application.

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