Infineon provides a recommended PCB layout in their application note AN2019-01, which includes guidelines for thermal vias, copper thickness, and component placement to minimize thermal resistance.
To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a suitable thermal interface material, and consider using a heat sink or cooling system. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal stress.
Operating the device at the maximum junction temperature (Tj) of 150°C can reduce its lifespan and reliability. It's recommended to operate the device at a lower temperature, ideally below 125°C, to ensure optimal performance and longevity.
To handle the high current requirements during startup, ensure that the power supply can provide the necessary current, and consider using a soft-start circuit or a current limiter to prevent inrush currents from damaging the device or the power supply.
To minimize EMI and EMC issues, follow proper PCB design guidelines, use shielding and filtering components, and ensure that the device is properly decoupled and grounded. Additionally, consider using a common-mode choke and a ferrite bead to reduce emissions.
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IRAM136-1561A2 Overview
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