- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IRF1607
- Part Number IRF1607
- Manufacturer Infineon
- Pin Count 3
- Part Category MOSFET (N-Channel)
- Package Category Transistor Outline, Vertical
- Footprint Name Transistor Outline, Vertical - TO-220AB 3pin
- Released Date Oct 6, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
IRF1607 Details
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Manufacturer Part Number:
IRF1607
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Package Description:
PLASTIC PACKAGE-3
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ECCN Code:
EAR99
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Manufacturer:
Infineon Technologies AG
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YTEOL:
0
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Additional Feature:
AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
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Avalanche Energy Rating (Eas):
1250 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
IRF1607 Frequently Asked Questions (FAQs)
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The maximum safe operating area (SOA) for the IRF1607 is not explicitly stated in the datasheet, but it can be determined by consulting Infineon's application note AN2013-03, which provides SOA curves for the device. The SOA is typically limited by the device's thermal and voltage ratings.
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To ensure proper thermal management, the IRF1607 should be mounted on a heat sink with a thermal resistance of less than 1°C/W. The heat sink should be designed to dissipate the maximum expected power loss, and the device should be attached to the heat sink using a thermal interface material (TIM) with a thermal resistance of less than 0.1°C/W.
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The recommended gate drive voltage for the IRF1607 is between 10V and 15V, with a maximum gate-source voltage of 20V. A higher gate drive voltage can improve switching performance, but may also increase power consumption and EMI.
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To protect the IRF1607 from overvoltage and overcurrent, a voltage clamp or surge protector can be used to limit the maximum voltage applied to the device. Additionally, a current sense resistor and a fuse or circuit breaker can be used to detect and respond to overcurrent conditions.
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The recommended PCB layout for the IRF1607 involves minimizing the distance between the device and the heat sink, using a solid copper plane for the drain connection, and keeping the gate and source connections as short and wide as possible to minimize inductance and resistance.
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IRF1607 Overview
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