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IRF7313TRPBFXTMA1 - Infineon

Description: MOSFET PLANAR 40<-<100V

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IRF7313TRPBFXTMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - SO-8 Package Outline
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IRF7313TRPBFXTMA1 Details

  • Manufacturer Part Number:

    IRF7313TRPBFXTMA1

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5.4

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    82 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    6.5 A

  • Drain-source On Resistance-Max:

    0.029 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    130 pF

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    65 ns

  • Turn-on Time-Max (ton):

    25 ns

IRF7313TRPBFXTMA1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IRF7313TRPBFXTMA1 can be found in the Infineon application note AN2013-01, which provides a detailed layout and footprint recommendation for optimal thermal performance and reliability.
  • To ensure proper cooling, follow the thermal design guidelines in the datasheet and application notes. Use a thermal pad or heat sink with a thermal interface material, and ensure good airflow around the device. The maximum junction temperature (Tj) should not exceed 150°C.
  • The IRF7313TRPBFXTMA1 can withstand voltage spikes up to 1.5 times the maximum rated voltage (Vds) for a short duration (typically < 1 ms). However, it's recommended to use a TVS diode or other protection circuitry to prevent damage from voltage transients.
  • Yes, the IRF7313TRPBFXTMA1 is suitable for high-frequency switching applications up to 1 MHz. However, ensure that the gate drive circuitry is properly designed to minimize ringing and overshoot, and that the device is properly cooled to prevent thermal issues.
  • The gate resistor value depends on the specific application and gate drive circuitry. A general guideline is to use a value between 10 Ω to 100 Ω. A higher value can help reduce power consumption, but may increase switching times. Consult the application notes and gate drive circuitry datasheets for more information.

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IRF7313TRPBFXTMA1 Overview

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