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IRFB20N50KPBF - Vishay

Description: MOSFET RECOMMENDED ALT 844-IRFB20N50K

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PCB Footprints
IRFB20N50KPBF - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220-1
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3D Models
IRFB20N50KPBF - Vishay  - 3D model - Transistor Outline, Vertical - TO-220-1
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IRFB20N50KPBF Details

  • Manufacturer Part Number:

    IRFB20N50KPBF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    330 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    20 A

  • Drain-source On Resistance-Max:

    0.25 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    280 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRFB20N50KPBF Frequently Asked Questions (FAQs)

  • The SOA for the IRFB20N50KPBF is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general rule, it's recommended to operate the device within the boundaries of the maximum voltage, current, and power dissipation ratings to ensure safe operation.
  • To ensure the IRFB20N50KPBF is fully turned on, apply a gate-source voltage (Vgs) of at least 10V, and for turn-off, bring Vgs below the threshold voltage (Vth) of around 2-3V. Additionally, use a suitable gate driver circuit to provide a fast rise and fall time for the gate voltage.
  • The maximum allowed Vds during switching is not explicitly stated in the datasheet. However, as a general guideline, it's recommended to limit Vds to around 80% of the maximum rated voltage (500V) to ensure reliable operation and minimize the risk of avalanche breakdown.
  • To ensure proper thermal management, provide a suitable heat sink with a thermal resistance (Rth) of around 1-2°C/W. Also, ensure good thermal interface material (TIM) between the MOSFET and heat sink. Monitor the junction temperature (Tj) and ensure it stays below the maximum rated temperature (150°C) to prevent thermal runaway.
  • For optimal performance and minimal parasitic inductance, use a PCB layout with wide, short traces (around 1-2 oz copper) and a solid ground plane. Keep the gate and source traces separate and as short as possible. A good rule of thumb is to use a trace width of at least 10-15 mils (0.25-0.38 mm) for the drain and source connections.

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Part Image IRFB20N50KPBF International Rectifier

Power Field-Effect Transistor, 20A I(D), 500V, 0.25ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB

Part Image IRFB20N50KPBF Vishay Siliconix

Power Field-Effect Transistor, 20A I(D), 500V, 0.25ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB

Part Image IRFB20N50K Vishay Intertechnologies

Power Field-Effect Transistor, 20A I(D), 500V, 0.25ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB