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IRFB9N60A - Vishay

Description: N-channel MOSFET,IRFB9N60A 9.2A 600V

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IRFB9N60A - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB_2022-1
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IRFB9N60A - Vishay  - 3D model - Transistor Outline, Vertical - TO-220AB_2022-1
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IRFB9N60A Details

  • Manufacturer Part Number:

    IRFB9N60A

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220AB, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    290 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    9.2 A

  • Drain-source On Resistance-Max:

    0.75 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e0

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    170 W

  • Pulsed Drain Current-Max (IDM):

    37 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRFB9N60A Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the IRFB9N60A is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. A safe operating area can be determined by considering the device's maximum junction temperature, voltage, and current ratings.
  • To ensure the IRFB9N60A is properly driven, use a gate driver with a high current capability (e.g., 1-2 A) and a low output impedance. The gate driver should be able to provide a fast rise and fall time (e.g., <10 ns) to minimize switching losses. Additionally, ensure the gate-source voltage (Vgs) is sufficient to fully enhance the device (e.g., Vgs ≥ 10 V).
  • To minimize parasitic inductance and capacitance, use a compact PCB layout with short, wide traces for the drain, source, and gate connections. Keep the gate trace as short as possible and use a low-inductance path for the gate driver. Use a solid ground plane and a decoupling capacitor (e.g., 100 nF) close to the device to reduce noise and ringing.
  • While the IRFB9N60A is suitable for high-frequency switching applications, its performance may be limited by its internal capacitances and parasitic inductances. To ensure reliable operation, consider the device's switching characteristics, such as its rise and fall times, and ensure the gate driver can provide a fast switching signal. Additionally, consider using a device with lower capacitances and inductances, such as a dedicated high-frequency MOSFET.
  • To protect the IRFB9N60A from electrostatic discharge (ESD), handle the device with care, using anti-static wrist straps, mats, and bags. Ensure the PCB is designed with ESD protection in mind, including the use of ESD protection diodes and resistors. During assembly, use a soldering iron with an anti-static tip, and avoid touching the device's pins or leads.

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