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IRGB4630DPBF - Infineon

Description: Infineon IRGB4630DPBF IGBT, 47 A 600 V, 3-Pin TO-220AB

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PCB Footprints
IRGB4630DPBF - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - T220AB
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IRGB4630DPBF - Infineon  - 3D model - Transistor Outline, Vertical - T220AB
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IRGB4630DPBF Details

  • Manufacturer Part Number:

    IRGB4630DPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    47 A

  • Collector-Emitter Voltage-Max:

    600 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    6.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    206 W

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    160 ns

  • Turn-on Time-Nom (ton):

    65 ns

  • VCEsat-Max:

    1.95 V

IRGB4630DPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRGB4630DPBF is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended thermal design and layout guidelines, and to implement adequate cooling mechanisms to prevent overheating.
  • The recommended PCB layout and thermal design for the IRGB4630DPBF can be found in the Infineon application note AN2013-01, which provides detailed guidelines for optimal thermal performance.
  • To handle the high current and power dissipation requirements of the IRGB4630DPBF, it's essential to use a robust power supply, implement adequate heat sinking, and ensure proper PCB design and layout.
  • To ensure EMI and EMC compliance, it's essential to follow the recommended PCB layout and design guidelines, use adequate shielding and filtering, and implement proper grounding and bonding techniques.

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