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IRL7472L1TRPbF - Infineon

Description: Infineon IRL7472L1TRPbF N-channel MOSFET, 645 A, 40 V DirectFET, 9+Tab-Pin L8

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IRL7472L1TRPbF - Infineon - PCB symbol
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PCB Footprints
IRL7472L1TRPbF - Infineon PCB footprint - Other - Other - DIRECTFET L8
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3D Models
IRL7472L1TRPbF - Infineon - 3D model - Other - DIRECTFET L8
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IRL7472L1TRPbF Details

  • Manufacturer Part Number:

    IRL7472L1TRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    765 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    68 A

  • Drain-source On Resistance-Max:

    0.00045 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-XBCC-N9

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    9

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    1500 A

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRL7472L1TRPbF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRL7472L1TRPBF is -55°C to 150°C.
  • To ensure reliability, follow proper thermal management, use a suitable heat sink, and ensure the device is operated within its specified ratings and guidelines.
  • Infineon provides a reference design and layout guidelines in the datasheet and application notes. Follow these guidelines to ensure optimal thermal performance and minimize parasitic inductance.
  • Yes, the IRL7472L1TRPBF is suitable for high-frequency switching applications up to 1 MHz. However, ensure proper PCB layout, decoupling, and filtering to minimize electromagnetic interference (EMI).
  • Handle the device with ESD-protective equipment, follow proper handling and storage procedures, and use ESD-protective packaging to prevent damage.

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IRL7472L1TRPbF Overview

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