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IRLMS5703TRPBF - Infineon

Description: INFINEON - IRLMS5703TRPBF - MOSFET Transistor, P Channel, -1.6 A, -30 V, 0.2 ohm, -10 V, -1 V

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IRLMS5703TRPBF - Infineon PCB footprint - Other - Other - IRLMS5703TRPBF-3
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IRLMS5703TRPBF - Infineon  - 3D model - Other - IRLMS5703TRPBF-3
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IRLMS5703TRPBF Details

  • Manufacturer Part Number:

    IRLMS5703TRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    ULTRA LOW RESISTANCE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    2.4 A

  • Drain-source On Resistance-Max:

    0.18 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    13 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRLMS5703TRPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRLMS5703TRPBF is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal management, and ensuring that the device is operated within its specified temperature range.
  • Infineon provides a recommended PCB layout and thermal design guide for the IRLMS5703TRPBF, which includes guidelines for thermal vias, heat sinks, and PCB material selection.
  • To handle the high current handling capability of the IRLMS5703TRPBF, ensure that your PCB design includes adequate copper thickness, track width, and via stitching to minimize resistance and thermal impedance.
  • The IRLMS5703TRPBF has built-in ESD protection, but it's still essential to follow proper ESD handling and prevention measures during manufacturing and assembly. Additionally, latch-up prevention can be achieved by following proper layout and design guidelines, including minimizing parasitic thyristor structures.

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IRLMS5703TRPBF Overview

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Part Image IRLMS5703 Infineon Technologies AG

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