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IRLZ34SPBF - Vishay

Description: N-Channel 60 V 30A (Tc) 3.7W (Ta), 88W (Tc) Surface Mount TO-263 (D²Pak)

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IRLZ34SPBF - Vishay PCB footprint - Other - Other - IRLZ34SPBF-4
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IRLZ34SPBF Details

  • Manufacturer Part Number:

    IRLZ34SPBF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED, HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    220 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    30 A

  • Drain-source On Resistance-Max:

    0.05 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    110 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRLZ34SPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRLZ34SPBF is -55°C to 150°C, as specified in the datasheet. However, it's recommended to derate the power dissipation accordingly to ensure reliable operation.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Additionally, use a solder with a melting point above 217°C to prevent damage to the device.
  • The recommended PCB layout for the IRLZ34SPBF involves keeping the leads as short as possible, using a solid ground plane, and placing a thermal pad under the device to improve heat dissipation. Consult the datasheet for more detailed guidelines.
  • Yes, the IRLZ34SPBF is suitable for high-frequency switching applications up to 1 MHz. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure proper PCB layout and decoupling to minimize ringing and EMI.
  • The IRLZ34SPBF has an internal ESD protection diode, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.

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IRLZ34SPBF Overview

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