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IRS2334SPBF - Infineon

Description: Gate Drivers 600V 3-Phase DRVR 10V to 20V 530ns

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IRS2334SPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-20
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IRS2334SPBF - Infineon  - 3D model - Small Outline Packages - SOIC-20
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IRS2334SPBF Details

  • Manufacturer Part Number:

    IRS2334SPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    65 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; UNDER VOLTAGE

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    12.7885 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    0.35 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.642 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.75 µs

  • Turn-on Time:

    0.75 µs

  • Width:

    7.5 mm

IRS2334SPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the IRS2334SPBF involves keeping the high-frequency switching nodes (e.g., drain-source voltage) as short as possible, using a solid ground plane, and minimizing the loop area of the high-current paths. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper cooling, it's essential to provide a good thermal interface between the device and the heat sink. Apply a thin layer of thermal interface material (TIM) to the device's exposed pad, and ensure the heat sink is securely fastened to the PCB. Additionally, consider using a heat sink with a high thermal conductivity and a sufficient surface area.
  • Monitor the device's junction temperature (Tj), drain-source voltage (Vds), and drain current (Id) to prevent overheating. Ensure that the device operates within the recommended operating conditions, and implement thermal protection mechanisms, such as thermal shutdown or current limiting, to prevent damage.
  • Optimize the gate drive circuit by selecting a suitable gate driver IC, ensuring a low impedance path between the gate driver and the IRS2334SPBF, and using a gate resistor (Rg) value that balances switching speed and EMI considerations. Additionally, consider using a gate-source voltage (Vgs) that is within the recommended range.
  • Handle the IRS2334SPBF with care to prevent damage from electrostatic discharge (ESD). Use an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or exposed pads, and use a vacuum pickup or tweezers to handle the device.

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IRS2334SPBF Overview

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