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IRS2336DSTRPBF - Infineon

Description: Gate Drivers 600V 3Phs Drvr IC w/Intgr BSF & Prot

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IRS2336DSTRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 28-Lead SOIC (wide body)
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IRS2336DSTRPBF - Infineon  - 3D model - Small Outline Packages - 28-Lead SOIC (wide body)
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IRS2336DSTRPBF Details

  • Manufacturer Part Number:

    IRS2336DSTRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8.38

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Peak Current Limit-Nom:

    0.35 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    3.5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.75 µs

  • Turn-on Time:

    0.75 µs

  • Width:

    7.5 mm

IRS2336DSTRPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal protection and overcurrent protection circuits.
  • Use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead to reduce EMI. Also, ensure that the device is operated within the recommended frequency range and that the PCB is designed to minimize radiation.
  • Use a logic analyzer or oscilloscope to monitor the device's inputs and outputs. Check the power supply voltage, clock signal, and data signals for any anomalies. Also, verify that the device is properly configured and that the PCB is free from defects.
  • Operating the device at a higher frequency than recommended may result in increased power consumption, reduced reliability, and potential damage to the device. It may also lead to electromagnetic interference (EMI) issues.

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IRS2336DSTRPBF Overview

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