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IS2020S-203-TRAY - Microchip

Description: Bluetooth v4.1 Stereo Headset and DSP Products

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IS2020S-203-TRAY - Microchip - PCB symbol
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PCB Footprints
IS2020S-203-TRAY - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - IS2020S-203-TRAY
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IS2020S-203-TRAY - Microchip - 3D model - Quad Flat No-Lead - IS2020S-203-TRAY
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IS2020S-203-TRAY Details

  • Manufacturer Part Number:

    IS2020S-203-TRAY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    VQFN-56

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.27SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

IS2020S-203-TRAY Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The datasheet provides a recommended land pattern, but additional thermal vias and a solid ground plane can help to further reduce thermal resistance.
  • To ensure reliable operation across the full temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered and mounted. Additionally, consider using a thermocouple or temperature sensor to monitor the device temperature and adjust the system design accordingly.
  • Operating the device at the maximum junction temperature can reduce its lifespan and reliability. It is recommended to operate the device at a temperature at least 10°C below the maximum junction temperature to ensure reliable operation and extend its lifespan.
  • ESD protection is critical for the IS2020S-203-TRAY. It is recommended to use a combination of ESD protection devices, such as TVS diodes and ESD arrays, and follow proper PCB design and layout guidelines to minimize the risk of ESD damage.
  • The IS2020S-203-TRAY is a sensitive electronic component and requires proper storage and handling procedures to prevent damage. It is recommended to store the devices in their original packaging, away from direct sunlight and moisture, and handle them with anti-static wrist straps or mats to prevent ESD damage.

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IS2020S-203-TRAY Overview

Use the download button to access the IS2020S-203-TRAY schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IS202, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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