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IS25LE01G-RILE - Integrated Silicon Solution Inc.

Description: NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 9ns 24-Pin LFBGA

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PCB Footprints
IS25LE01G-RILE - Integrated Silicon Solution Inc. PCB footprint - BGA - BGA - 24-BALL THIN PROFILE FINE PITCH BGA 6X8X1.40MM 5X5 BALL ARRAY
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3D Models
IS25LE01G-RILE - Integrated Silicon Solution Inc.  - 3D model - BGA - 24-BALL THIN PROFILE FINE PITCH BGA 6X8X1.40MM 5X5 BALL ARRAY
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IS25LE01G-RILE Details

  • Manufacturer Part Number:

    IS25LE01G-RILE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Integrated Silicon Solution Inc

  • YTEOL:

    6.25

  • Alternate Memory Width:

    1

  • Clock Frequency-Max (fCLK):

    166 MHz

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

IS25LE01G-RILE Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the IS25LE01G-RILE is 2.7V to 3.6V.
  • To ensure data integrity during power-down or power-up sequences, it is recommended to follow the power-up and power-down sequencing guidelines outlined in the datasheet, and to use a voltage supervisor or reset circuit to ensure that the device is properly initialized.
  • The maximum clock frequency supported by the IS25LE01G-RILE is 104 MHz.
  • To handle errors during SPI communication with the IS25LE01G-RILE, implement error detection and correction mechanisms, such as CRC checks and retry mechanisms, to ensure reliable data transfer.
  • The typical programming time for the IS25LE01G-RILE is 10-20 microseconds per byte, depending on the programming algorithm and system configuration.

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IS25LE01G-RILE Overview

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