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ISC030N10NM6ATMA1 - Infineon

Description: N-Channel 100 V 21A (Ta), 179A (Tc) 3W (Ta), 208W (Tc) Surface Mount PG-TDSON-8 FL

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ISC030N10NM6ATMA1 - Infineon PCB footprint - Other - Other - ISC030N10NM6ATMA1-3
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ISC030N10NM6ATMA1 - Infineon  - 3D model - Other - ISC030N10NM6ATMA1-3
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ISC030N10NM6ATMA1 Details

  • Manufacturer Part Number:

    ISC030N10NM6ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    988 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    179 A

  • Drain-source On Resistance-Max:

    0.003 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    22 pF

  • JESD-30 Code:

    R-PDSO-F8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    208 W

  • Pulsed Drain Current-Max (IDM):

    716 A

  • Reference Standard:

    IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ISC030N10NM6ATMA1 Frequently Asked Questions (FAQs)

  • The ISC030N10NM6ATMA1 can operate from -40°C to 150°C, making it suitable for high-reliability applications.
  • The device has a thermal pad on the bottom, which should be connected to a heat sink or a thermal interface material to ensure proper heat dissipation.
  • A 2-layer or 4-layer PCB is recommended, with a solid ground plane and a separate power plane for the device. Keep the layout symmetrical and avoid vias under the device.
  • Use a sufficient power supply and ensure the PCB traces can handle the high current. Consider using a dedicated power plane and multiple vias to reduce resistance.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device, such as using an ESD wrist strap or mat.

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ISC030N10NM6ATMA1 Overview

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