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ISL1571IRZ-T7 - Renesas Electronics

Description: The ISL1571 is a dual operational amplifier designed for PLC line driving in Orthogonal Frequency-Division Multiplexing (OFDM) and Spread Spectrum Communication (SSC) based solutions. This device features a high drive capability of 750mA while consuming only 6mA of supply current per amplifier and operating from a single 4. 5V to 12V supply. The driver achieves a typical distortion of -80dBc, at 150kHz into a 25Ω load. The ISL1571 is available in the thermally-enhanced 16 Ld QFN or 10 Ld HMSOP package and i

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ISL1571IRZ-T7 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16 Ld QFN-1
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ISL1571IRZ-T7 - Renesas Electronics  - 3D model - Quad Flat No-Lead - 16 Ld QFN-1
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ISL1571IRZ-T7 Details

  • Manufacturer Part Number:

    ISL1571IRZ-T7

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    L16.4X4H

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Bandwidth (3dB)-Nom:

    200 MHz

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    7500 µV

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    13.2 V

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.03 mm

  • Slew Rate-Min:

    750 V/us

  • Slew Rate-Nom:

    1200 V/us

  • Supply Current-Max:

    21.5 mA

  • Supply Voltage Limit-Max:

    13.2 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ISL1571IRZ-T7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL1571IRZ-T7 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, the input and output capacitors should be selected based on the specific application requirements, and the device should be operated within its recommended operating conditions.
  • The ISL1571IRZ-T7 has a thermal shutdown feature that protects the device from overheating. To ensure reliable operation, it's essential to provide adequate heat sinking and airflow around the device. The device's thermal resistance (θJA) should be considered when designing the system's thermal management.
  • To troubleshoot issues with the ISL1571IRZ-T7, start by verifying the input voltage, output voltage, and current. Check the device's operating conditions, PCB layout, and component values. Use an oscilloscope to measure the input and output waveforms, and consult the datasheet and application notes for guidance.
  • To minimize EMI, it's essential to follow good PCB layout practices, such as keeping the input and output traces short and away from noise-sensitive areas. Additionally, using shielding, filtering, and grounding techniques can help reduce EMI emissions.

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ISL1571IRZ-T7 Overview

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