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ISL21007CFB825Z-TK - Renesas Electronics

Description: Support is limited to customers who have already adopted these products.The ISL21007 FGA™ voltage references are extremely low power, high precision, and low noise voltage references fabricated on Intersil's proprietary Floating Gate Analog technology. The ISL21007 features very low noise (4. 5µVP-P for 0. 1Hz to 10Hz) and very low operating current (150µA, Max). In addition, the ISL21007 family features guaranteed initial accuracy as low as ±0. 5mV. This combination of high initial accuracy, low drift, and

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ISL21007CFB825Z-TK - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8-15
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ISL21007CFB825Z-TK - Renesas Electronics  - 3D model - Small Outline Packages - M8-15
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ISL21007CFB825Z-TK Details

  • Manufacturer Part Number:

    ISL21007CFB825Z-TK

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    2.501 V

  • Output Voltage-Min:

    2.499 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.15 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temp Coef of Voltage-Max:

    5 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Trim/Adjustable Output:

    YES

  • Voltage Tolerance-Max:

    0.04%

  • Width:

    3.9 mm

ISL21007CFB825Z-TK Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note AN1443, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The device's operating temperature range is -40°C to 125°C. Ensure proper thermal management by providing adequate heat sinking, using thermal vias, and keeping the device away from heat sources. Also, follow the recommended PCB layout guidelines to minimize thermal resistance.
  • Renesas recommends using a 10uF to 22uF X5R or X7R ceramic capacitor with a voltage rating of 6.3V or higher for the input capacitor (CIN). This ensures stable operation and minimizes noise.
  • Check the PCB layout for any signs of noise coupling, ensure proper decoupling of the input and output capacitors, and verify that the output capacitor value and ESR are within the recommended range. Also, check for any signs of overheating or thermal issues.
  • The maximum output current capability of the ISL21007CFB825Z-TK is 800mA. However, the actual output current capability may be limited by the thermal performance of the device and the PCB layout.

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ISL21007CFB825Z-TK Overview

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