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ISL21010CFH325Z-TK - Renesas Electronics

Description: The ISL21010 is a precision, low dropout micropower bandgap voltage reference in a space-saving SOT-23 package. It operates from a single 2. 2V to 5. 5V supply (minimum voltage is dependent on voltage option) and provides a ±0. 2% accurate reference. The ISL21010 provides up to 25mA output current sourcing with low 150mV dropout voltage. Output voltage options include 1. 024V, 1. 2V, 1. 5V, 2. 048V, 2. 5V, 3. 0V, 3. 3V, and 4. 096V. The low supply current and low dropout voltage combined with high accuracy

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ISL21010CFH325Z-TK - Renesas Electronics PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - P3.064-ren1
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ISL21010CFH325Z-TK - Renesas Electronics  - 3D model - SOT23 (3-Pin) - P3.064-ren1
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ISL21010CFH325Z-TK Details

  • Manufacturer Part Number:

    ISL21010CFH325Z-TK

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT23

  • Package Description:

    SOT-23, 3PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    P3.064

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-04

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    2.505 V

  • Output Voltage-Min:

    2.495 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.1 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temp Coef of Voltage-Max:

    50 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.2%

  • Width:

    1.3 mm

ISL21010CFH325Z-TK Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL21010CFH325Z-TK involves keeping the input and output traces short and wide, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure the stability of the output voltage, it is essential to follow the recommended capacitor selection and placement guidelines, use a low-ESR output capacitor, and ensure that the input voltage is within the recommended range. Additionally, the output voltage can be stabilized by adding a capacitor in parallel with the output resistor.
  • The maximum ambient temperature range for the ISL21010CFH325Z-TK is -40°C to +125°C. However, the device can operate at a junction temperature of up to 150°C.
  • Yes, the ISL21010CFH325Z-TK is suitable for high-reliability applications. It is manufactured using a high-reliability process, and it has undergone rigorous testing to ensure its reliability. However, it is essential to follow the recommended design and layout guidelines to ensure the device operates within its specified parameters.
  • To troubleshoot issues with the ISL21010CFH325Z-TK, start by checking the input voltage, output voltage, and current. Verify that the device is properly soldered and that the PCB layout is correct. Check for any signs of overheating, and ensure that the device is operated within its specified parameters. If the issue persists, consult the datasheet and application notes for further guidance.

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