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ISL2101AABZ - Renesas Electronics

Description: The ISL2100A, ISL2101A are 100V, high frequency, half-bridge N-channel power MOSFET driver ICs. They are based on the popular HIP2100, HIP2101 half-bridge drivers, but offer several performance improvements. The ISL2100A has additional input hysteresis for superior operation in noisy environments and the inputs of the ISL2101A, like those of the ISL2100A, can now safely swing to the VDD supply rail. Finally, both parts are available in a very compact 9 Ld DFN package to minimize the required PCB footprint.

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ISL2101AABZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8-15
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ISL2101AABZ - Renesas Electronics  - 3D model - Small Outline Packages - M8-15
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ISL2101AABZ Details

  • Manufacturer Part Number:

    ISL2101AABZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-04

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    14 V

  • Supply Voltage-Min:

    9 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    114 V

  • Supply Voltage1-Min:

    7 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.06 µs

  • Turn-on Time:

    0.06 µs

  • Width:

    3.9 mm

ISL2101AABZ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the ISL2101AABZ involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it is recommended to use a separate analog ground plane and to keep the analog and digital grounds separate.
  • To ensure the stability of the ISL2101AABZ voltage reference output, it is recommended to use a capacitor with a value between 10nF to 100nF between the VOUT pin and the GND pin. Additionally, the output voltage should be buffered with an op-amp if it is being used to drive a load.
  • The maximum allowed power dissipation for the ISL2101AABZ is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 440mW at an ambient temperature of 70°C. However, it is recommended to derate the power dissipation by 4mW/°C above 70°C.
  • The ISL2101AABZ is rated for operation up to 125°C, making it suitable for use in high-temperature environments. However, the device's accuracy and stability may be affected at high temperatures, and the maximum power dissipation should be derated accordingly.
  • To protect the ISL2101AABZ from EMI, it is recommended to use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, the PCB layout should be designed to minimize loop areas and keep the input and output traces away from each other.

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ISL2101AABZ Overview

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