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ISL28230FRZ-T7A - Renesas Electronics

Description: The ISL28130, ISL28230 and ISL28430 are single, dual and quad micropower, low offset drift operational amplifiers that are optimized for single and dual supply operation from 1. 8V to 5. 5V and ±0. 9V to ±2. 75V. Their low supply current of 20µA and rail-to-rail input/output enable the ISL28130, ISL28230, and ISL28430 to be an excellent general-purpose op amp for a range of applications. The ISL28130, ISL28230 and ISL28430 are ideal for handheld devices that operate off 2AA or single Li-ion batteries. The I

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ISL28230FRZ-T7A - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - L8.3x3J+
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ISL28230FRZ-T7A - Renesas Electronics  - 3D model - Small Outline No-lead - L8.3x3J+
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ISL28230FRZ-T7A Details

  • Manufacturer Part Number:

    ISL28230FRZ-T7A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DFN

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    L8.3X3J

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0007 µA

  • Bias Current-Max (IIB) @25C:

    0.0007 µA

  • Common-mode Reject Ratio-Min:

    105 dB

  • Common-mode Reject Ratio-Nom:

    125 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    55 µV

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    0.2 V/us

  • Supply Current-Max:

    0.07 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    400

  • Wideband:

    NO

  • Width:

    3 mm

ISL28230FRZ-T7A Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for optimal performance. Renesas recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital grounds separate. Additionally, place the input and output capacitors close to the IC, and use short, wide traces for the power lines.
  • To ensure stability, make sure to follow the recommended component values and PCB layout. Also, ensure that the output capacitor is properly sized and placed close to the IC. Additionally, consider adding a small series resistor (e.g., 1Ω) between the output and the load to prevent oscillations.
  • The ISL28230FRZ-T7A can tolerate up to 10% of the input voltage as ripple. However, it's recommended to keep the input voltage ripple below 5% to ensure optimal performance and prevent instability.
  • While it's possible to use a different inductor value, it's not recommended. The recommended inductor value is carefully selected to ensure optimal performance and stability. Using a different value may affect the converter's efficiency, stability, and overall performance.
  • The ISL28230FRZ-T7A has a thermal pad on the bottom of the package. Ensure good thermal contact between the pad and the PCB by using a thermal interface material (e.g., thermal tape or thermal grease). Also, consider adding thermal vias to the PCB to improve heat dissipation.

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