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ISL28291FBZ - Renesas Electronics

Description: The  ISL28291 is a tiny, dual, ultra-low noise, ultra-low distortion operational amplifier. It is fully specified to operate down to +3V single supply. This amplifier has outputs that swing rail-to-rail and an input common mode voltage that extends to ground (ground sensing). The device is unity gain stable with an input referred voltage noise of 1.7nV/√Hz. Both parts feature 0.00018% THD+N at 1kHz. The ISL28291 is available in the 8 Ld SOIC, 10 Ld 1.8mm x 1.4mm UTQFN and 10 Ld MSOP packages. All devices ar

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ISL28291FBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15E/1
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ISL28291FBZ Details

  • Manufacturer Part Number:

    ISL28291FBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    ROHS COMPLIANT, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15E

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    7 µA

  • Bandwidth (3dB)-Nom:

    61 MHz

  • Bias Current-Max (IIB) @25C:

    6 µA

  • Common-mode Reject Ratio-Min:

    78 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.9 µA

  • Input Offset Voltage-Max:

    840 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUT LINE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    YES

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    12 V/us

  • Slew Rate-Nom:

    17 V/us

  • Supply Current-Max:

    7 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Gain-Min:

    79432.82

  • Wideband:

    YES

  • Width:

    3.9 mm

ISL28291FBZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in the application note AN1995, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output capacitors depends on the specific application and frequency range. Renesas recommends using low-ESR capacitors with a value of 10uF to 22uF for input and output decoupling. The application note AN1995 provides more detailed guidance on capacitor selection.
  • The maximum power dissipation of the ISL28291FBZ is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to consult the thermal derating curve in the datasheet to determine the maximum power dissipation for a specific application.
  • The ISL28291FBZ is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. Renesas recommends consulting the datasheet and application notes for guidance on using the device in high-temperature environments.
  • To ensure EMC with the ISL28291FBZ, Renesas recommends following good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as necessary. Additionally, the application note AN1995 provides guidance on EMC considerations for the device.

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