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ISL3153EIUZ - Renesas Electronics

Description: The ISL315xE family of 5V powered RS-485/RS-422 transceivers features high output drive and high ESD protection. The devices withstand ±16. 5kV IEC61000-4- 2 ESD strikes without latch-up. The large output voltage of 3. 1V typical into a 54Ω load provides high noise immunity, and enables the drive of up to 8000ft long bus segments, or eight 120Ω terminations in a star topology. These devices possess less than 125μA bus input currents, thus constituting a true 1/8 unit load. The high output drive combined wit

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ISL3153EIUZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M10.118
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ISL3153EIUZ - Renesas Electronics  - 3D model - Small Outline Packages - M10.118
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ISL3153EIUZ Details

  • Manufacturer Part Number:

    ISL3153EIUZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    M10.118

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2.4 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    150 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    400 ns

  • Width:

    3 mm

ISL3153EIUZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL3153EIUZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to place the capacitors as close as possible to the device pins.
  • To ensure proper power-up and initialization of the ISL3153EIUZ, make sure to follow the recommended power-up sequence, which involves applying VCC before applying VDD. Also, ensure that the reset pin is properly connected and that the device is in a valid operating mode.
  • When selecting external capacitors for the ISL3153EIUZ, consider the capacitor's equivalent series resistance (ESR), voltage rating, and capacitance value. A low ESR and a high-quality capacitor with a suitable voltage rating and capacitance value are recommended to ensure stable operation.
  • To troubleshoot issues with the ISL3153EIUZ, start by verifying the power supply and clock signals, then check the device's configuration and register settings. Use a logic analyzer or oscilloscope to monitor the device's signals and identify any anomalies. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • To ensure proper thermal management of the ISL3153EIUZ, consider the device's thermal resistance, power dissipation, and junction temperature. Use a heat sink or thermal pad if necessary, and ensure good airflow around the device. Monitor the device's temperature and adjust the system design as needed to prevent overheating.

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ISL3153EIUZ Overview

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