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ISL3159EFBZ-T7A - Renesas Electronics

Description: The ISL3159E is a ±15kV IEC61000 ESD protected, 5V powered, single transceiver that meets both the RS-485 and RS-422 standards for balanced communication. It also features the larger output voltage and higher data rate (up to 40Mbps) required by high speed PROFIBUS applications, and is offered in industrial and extended Industrial (-40°C to +125°C) temperature ranges. The low bus currents (+220µA/-150µA) present a “1/5 unit load” to the RS-485 bus. This allows up to 160 transceivers on the network without v

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ISL3159EFBZ-T7A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 8 Ld SOIC_
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ISL3159EFBZ-T7A Details

  • Manufacturer Part Number:

    ISL3159EFBZ-T7A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2.1 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.04 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    13 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    2.6 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    12 ns

  • Width:

    3.9 mm

ISL3159EFBZ-T7A Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL3159EFBZ-T7A involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence, which is to apply VCC first, followed by VDD. Also, ensure that the input voltage is within the recommended range, and that the device is properly reset after power-up.
  • Thermal management is crucial for the ISL3159EFBZ-T7A. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Also, avoid overheating the device by keeping the junction temperature below 150°C.
  • To troubleshoot issues with the ISL3159EFBZ-T7A, start by reviewing the datasheet and application notes to ensure proper usage. Then, use a logic analyzer or oscilloscope to capture waveforms and debug the issue. Also, check for proper power supply, clock signals, and signal integrity.
  • To ensure EMI and EMC compliance, follow proper PCB layout and design guidelines, use shielding and filtering where necessary, and ensure that the device is properly decoupled. Also, consider using a common-mode choke or ferrite bead to reduce EMI emissions.

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ISL3159EFBZ-T7A Overview

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