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ISL3159EIBZ - Renesas Electronics

Description: The ISL3159E is a ±15kV IEC61000 ESD protected, 5V powered, single transceiver that meets both the RS-485 and RS-422 standards for balanced communication. It also features the larger output voltage and higher data rate (up to 40Mbps) required by high speed PROFIBUS applications, and is offered in industrial and extended Industrial (-40°C to +125°C) temperature ranges. The low bus currents (+220µA/-150µA) present a “1/5 unit load” to the RS-485 bus. This allows up to 160 transceivers on the network without v

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ISL3159EIBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15-ren4
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ISL3159EIBZ - Renesas Electronics  - 3D model - Small Outline Packages - M8.15-ren4
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ISL3159EIBZ Details

  • Manufacturer Part Number:

    ISL3159EIBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2.1 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.04 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    13 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    2.6 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    12 ns

  • Width:

    3.9 mm

ISL3159EIBZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL3159EIBZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper power-up and initialization of the ISL3159EIBZ, make sure to follow the recommended power-up sequence, which involves applying VCC before applying VDD. Also, ensure that the device is properly reset by pulling the RESET pin low during power-up.
  • When selecting external capacitors for the ISL3159EIBZ, consider the capacitor's equivalent series resistance (ESR), voltage rating, and temperature coefficient. Choose capacitors with low ESR, a voltage rating that exceeds the maximum voltage of the device, and a temperature coefficient that matches the operating temperature range of the device.
  • To troubleshoot issues with the ISL3159EIBZ, start by verifying the power supply and clock signals. Check the device's reset and interrupt pins for proper operation. Use a logic analyzer or oscilloscope to monitor the device's communication signals and verify that they conform to the specified protocol.
  • To ensure proper thermal management of the ISL3159EIBZ, consider the device's junction-to-ambient thermal resistance (RθJA) and the maximum operating temperature. Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Avoid blocking the airflow around the device or using a PCB layout that can trap heat.

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ISL3159EIBZ Overview

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