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ISL3173EIUZ - Renesas Electronics

Description: The Renesas ISL317xE are ±15kV IEC61000 ESD protected, 3. 3V powered single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. These devices have very low bus currents (+125µA/-100µA), so they present a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification's 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are r

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ISL3173EIUZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M10.118
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ISL3173EIUZ - Renesas Electronics  - 3D model - Small Outline Packages - M10.118
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ISL3173EIUZ Details

  • Manufacturer Part Number:

    ISL3173EIUZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • Manufacturer Package Code:

    M10.118

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.004 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    120 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    800 ns

  • Width:

    3 mm

ISL3173EIUZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL3173EIUZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence, which is to apply VCC first, followed by VDD. Also, ensure that the EN pin is tied to a valid logic level (either VCC or GND) to prevent unwanted device behavior.
  • The ISL3173EIUZ has a maximum junction temperature of 150°C. To ensure reliable operation, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device near its maximum temperature rating. Also, follow the recommended PCB layout guidelines to minimize thermal resistance.
  • To troubleshoot issues with the ISL3173EIUZ, start by verifying the power supply and clock signals. Check the device's output signals using an oscilloscope or logic analyzer. Also, review the device's configuration and programming to ensure that it is set up correctly. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the ISL3173EIUZ is a high-speed device and requires proper EMI/EMC design considerations. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference. Follow the recommended PCB layout guidelines and use EMI-absorbing materials to reduce radiation.

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ISL3173EIUZ Overview

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