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ISL3177EIUZ-T - Renesas Electronics

Description: The Renesas ISL317xE are ±15kV IEC61000 ESD protected, 3. 3V powered single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. These devices have very low bus currents (+125µA/-100µA), so they present a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification's 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are r

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ISL3177EIUZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.118
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ISL3177EIUZ-T Details

  • Manufacturer Part Number:

    ISL3177EIUZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.118

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.004 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    60 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    40 ns

  • Width:

    3 mm

ISL3177EIUZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL3177EIUZ-T involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence, which is to apply VCC first, followed by VDD. Also, ensure that the EN pin is pulled high after VCC and VDD are stable.
  • The ISL3177EIUZ-T has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as using a thermal pad or a heat sink, and to keep the device away from heat sources.
  • To troubleshoot issues with the ISL3177EIUZ-T, start by verifying the power supply and clock signals. Check the device's operating conditions, such as temperature and voltage, and ensure that the device is properly configured and initialized. Use oscilloscopes or logic analyzers to debug the signals and identify the root cause of the issue.
  • Yes, to minimize EMI/EMC issues, ensure that the PCB layout is designed to reduce radiation and susceptibility. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference. Also, follow the recommended layout and routing guidelines to reduce electromagnetic emissions.

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ISL3177EIUZ-T Overview

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