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ISL3179EFBZ - Renesas Electronics

Description: The ISL3179E and ISL3180E are high ESD protected, 3. 3V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. Each device has low bus currents (+220μA/-150μA), so they present a “1/5 unit load” to the RS-485 bus. This allows up to 160 transceivers on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. Receiver (Rx) inputs feature a “full fail-safe” design, which ensures a logic high Rx output if Rx inpu

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ISL3179EFBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8-15-
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ISL3179EFBZ Details

  • Manufacturer Part Number:

    ISL3179EFBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.01 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    16.5 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    16 ns

  • Width:

    3.9 mm

ISL3179EFBZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL3179EFBZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper power-up and initialization, apply power to the device in the following sequence: VCC, then VDD, and finally the input signals. Also, make sure to follow the recommended power-up timing and voltage ramp rates specified in the datasheet.
  • When selecting external capacitors for the ISL3179EFBZ, consider the capacitor's equivalent series resistance (ESR), voltage rating, and temperature coefficient. Choose capacitors with low ESR, a voltage rating that exceeds the maximum voltage on the pin, and a temperature coefficient that matches the operating temperature range.
  • To troubleshoot issues with the ISL3179EFBZ, start by verifying the power supply voltages, checking for proper pin connections, and ensuring that the device is properly configured. Use an oscilloscope to monitor the signals and check for any anomalies. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • To manage thermal issues with the ISL3179EFBZ, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the package. Follow the recommended thermal design guidelines in the datasheet and application notes to prevent overheating and ensure reliable operation.

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ISL3179EFBZ Overview

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