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ISL32172EFBZ - Renesas Electronics

Description: The ISL32172E, ISL32272E, ISL32174E, and ISL32179E are ±16. 5kV IEC61000-4-2 ESD protected, 3. 0V to 5. 5V powered, QUAD transmitters for balanced communication using the RS-422 standard. These drivers have very low output leakage currents (±10µA), so they present a low load to the RS-422 bus. The driver (Tx) outputs are tri-statable and incorporate a hot plug feature to keep them disabled during power-up and power-down. The ISL32172E and ISL32272E have a common EN/EN, the ISL32174E has a two channel EN12/E

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ISL32172EFBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M16.15 (JEDEC MS-012-AC ISSUE C) 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
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ISL32172EFBZ - Renesas Electronics  - 3D model - Small Outline Packages - M16.15 (JEDEC MS-012-AC ISSUE C) 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
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ISL32172EFBZ Details

  • Manufacturer Part Number:

    ISL32172EFBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-10-10

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    CAN ALSO OPERATE FROM VCC=3 TO 3.6V

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00003 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-422

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    15 ns

  • Width:

    3.9 mm

ISL32172EFBZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL32172EFBZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to place the device close to the power supply and use a decoupling capacitor between the VCC and GND pins.
  • To ensure the ISL32172EFBZ operates within its specified temperature range, it's essential to provide adequate heat sinking, especially in high-power applications. A thermal pad on the bottom of the package can be connected to a heat sink or a thermal plane on the PCB to dissipate heat efficiently.
  • When handling the ISL32172EFBZ, it's essential to take precautions to prevent damage from electrostatic discharge (ESD). Use an ESD wrist strap or mat, handle the device by the package body, and avoid touching the pins or leads. Also, avoid bending or flexing the leads, as this can cause mechanical stress and damage to the device.
  • To troubleshoot issues with the ISL32172EFBZ, start by verifying the power supply voltage, input voltage, and output voltage using an oscilloscope or multimeter. Check the PCB layout for any signs of noise or oscillations, and ensure that the device is properly decoupled. If the issue persists, consult the datasheet and application notes for guidance on troubleshooting and debugging.
  • To ensure EMC with the ISL32172EFBZ, it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding or filtering to reduce electromagnetic interference (EMI). Additionally, ensure that the device is properly decoupled, and consider using a common-mode choke or ferrite bead to reduce EMI emissions.

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ISL32172EFBZ Overview

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