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ISL32174EFVZ - Renesas Electronics

Description: The ISL32172E, ISL32272E, ISL32174E, and ISL32179E are ±16. 5kV IEC61000-4-2 ESD protected, 3. 0V to 5. 5V powered, QUAD transmitters for balanced communication using the RS-422 standard. These drivers have very low output leakage currents (±10µA), so they present a low load to the RS-422 bus. The driver (Tx) outputs are tri-statable and incorporate a hot plug feature to keep them disabled during power-up and power-down. The ISL32172E and ISL32272E have a common EN/EN, the ISL32174E has a two channel EN12/E

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ISL32174EFVZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 16 LD
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ISL32174EFVZ - Renesas Electronics  - 3D model - Small Outline Packages - 16 LD
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ISL32174EFVZ Details

  • Manufacturer Part Number:

    ISL32174EFVZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.173

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-10

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Additional Feature:

    CAN ALSO OPERATE FROM VCC=3 TO 3.6V

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00003 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-422

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    15 ns

  • Width:

    4.4 mm

ISL32174EFVZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL32174EFVZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliable communication in noisy environments, it's recommended to use a common-mode choke or a ferrite bead in series with the RS-485 bus, and to use shielded cables. Additionally, implementing error-checking mechanisms such as CRC or checksum can help detect and correct errors.
  • The maximum cable length for reliable communication using the ISL32174EFVZ depends on the baud rate and the cable characteristics. As a general rule, the maximum cable length is approximately 4000 feet (1219 meters) at 9600bps, and 1000 feet (305 meters) at 115.2kbps.
  • To handle hot-swapping or live-insertion of devices, it's recommended to use a transient voltage suppressor (TVS) diode to protect the device from voltage spikes, and to use a power-on reset (POR) circuit to ensure a clean power-up sequence.
  • The ISL32174EFVZ has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. This can be achieved by using a heat sink, improving air flow, and reducing power consumption.

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ISL32174EFVZ Overview

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