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ISL32613EFHZ-T - Renesas Electronics

Description: The ISL32613E and ISL32614E are ±16. 5kV HBM ESD protected (7kV IEC61000 contact), 1. 8V powered, single transmitters for differential communication. These drivers have very low bus currents (±40µA), so they present less than a 1/8 unit load to the bus. The low bus currents allow more than 256 transmitters on the network without violating the RS-485 specification’s 32 unit load maximum and without using repeaters. Hot plug circuitry ensures that the Tx outputs remain in a high impedance state while the powe

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PCB Footprints
ISL32613EFHZ-T - Renesas Electronics PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT23_6
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ISL32613EFHZ-T - Renesas Electronics  - 3D model - SOT23 (6-Pin) - SOT23_6
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ISL32613EFHZ-T Details

  • Manufacturer Part Number:

    ISL32613EFHZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT23

  • Package Description:

    SOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    P6.064

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-11-13

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    3.3 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    2.7 V

  • Supply Voltage1-Max:

    3.3 V

  • Supply Voltage1-Min:

    1.8 V

  • Supply Voltage1-Nom:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2600 ns

  • Width:

    1.6 mm

ISL32613EFHZ-T Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note AN1995, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize EMI.
  • The ISL32613EFHZ-T has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, the device has a thermal shutdown feature that turns off the output when the junction temperature exceeds 150°C.
  • Renesas recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure stable operation.
  • The output voltage of the ISL32613EFHZ-T can be adjusted by connecting a resistor divider network between the VOUT pin and the GND pin. The resistor values can be calculated using the formula provided in the datasheet, and the output voltage can be set to any value between 0.8V and 3.3V.
  • The ISL32613EFHZ-T has a maximum output current capability of 3A. However, the actual output current capability may be limited by the thermal performance of the device and the PCB design. It is recommended to consult the datasheet and application notes for more information on output current capability and thermal management.

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