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ISL32704EIBZ - Renesas Electronics

Description: The ISL32704E is a galvanically isolated, differential bus transceiver designed for bidirectional data transmission and meeting the RS-485 and RS-422 standards for balanced communication. Each of the bus terminals, A and B, is protected against ±15kV ESD strikes without latch-up. The device uses giant magnetoresistance (GMR) as isolation technology. A unique ceramic/polymer composite barrier provides excellent isolation and virtually unlimited barrier life. The part is available in a 16 Ld QSOP package offe

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ISL32704EIBZ - Renesas Electronics - PCB symbol
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PCB Footprints
ISL32704EIBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M16.3A
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ISL32704EIBZ - Renesas Electronics - 3D model - Small Outline Packages - M16.3A
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ISL32704EIBZ Details

  • Manufacturer Part Number:

    ISL32704EIBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICW

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.3A

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.285 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.06 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Receive Delay-Max:

    150 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    2.67 mm

  • Supply Current-Max:

    16 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.3 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    150 ns

  • Width:

    7.505 mm

ISL32704EIBZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in the application note AN1995, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize EMI.
  • The ISL32704EIBZ has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, the device has a thermal shutdown feature that turns off the output when the junction temperature exceeds 150°C.
  • Renesas recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • The output voltage of the ISL32704EIBZ can be adjusted by connecting a resistive divider network between the VOUT pin and the GND pin. The resistors should be chosen to provide a voltage divider ratio that sets the desired output voltage. Renesas provides a calculation formula in the datasheet to determine the required resistor values.
  • The ISL32704EIBZ has a maximum output current capability of 4A. However, the actual output current capability may be limited by the input voltage, output voltage, and thermal conditions. Renesas provides a current derating curve in the datasheet to help determine the maximum output current capability under specific operating conditions.

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ISL32704EIBZ Overview

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