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ISL33001IBZ-T - Renesas Electronics

Description: The ISL33001 two-channel bus buffer provides the buffering necessary to extend the bus capacitance beyond the 400pF maximum specified by the I2C specification. In addition, the ISL33001 features rise time accelerator circuitry to reduce power consumption from passive bus pull-up resistors and improve data-rate performance. The device also includes hot-swap circuitry to prevent corruption of the data and clock lines when I2C devices are plugged into a live backplane. The ISL33001 operates at supply voltages

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ISL33001IBZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15-ren4
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ISL33001IBZ-T - Renesas Electronics  - 3D model - Small Outline Packages - M8.15-ren4
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ISL33001IBZ-T Details

  • Manufacturer Part Number:

    ISL33001IBZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Malaysia, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-13

  • Manufacturer:

    Renesas Electronics Corporation

  • Interface IC Type:

    BUS BUFFERS

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

ISL33001IBZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL33001IBZ-T involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-on and power-off sequencing, it's recommended to follow the power-up and power-down sequences outlined in the datasheet. This typically involves powering up the device in the following order: VCC, VIN, and then EN. When powering down, the sequence should be reversed.
  • The ISL33001IBZ-T has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking and airflow to keep the device within its recommended operating temperature range. A thermal pad on the bottom of the package can be connected to a copper plane on the PCB to improve heat dissipation.
  • To troubleshoot issues with the ISL33001IBZ-T, start by verifying the power supply voltages and ensuring that the device is properly powered on and off. Check the input and output voltages, and verify that the device is operating within its recommended specifications. If issues persist, consult the datasheet and application notes for guidance on troubleshooting common problems.
  • To minimize electromagnetic interference (EMI) and ensure electromagnetic compatibility (EMC), it's recommended to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding where necessary. Additionally, ensure that the device is properly decoupled and that the input and output filters are properly designed.

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ISL33001IBZ-T Overview

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