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ISL33002IRT2Z-T - Renesas Electronics

Description: The ISL33002 two-channel bus buffer provides the buffering necessary to extend the bus capacitance beyond the 400pF maximum specified by the I2C specification. In addition, the ISL33002 features rise time accelerator circuitry to reduce power consumption from passive bus pull-up resistors and improve data-rate performance. The device also includes hot-swap circuitry to prevent corruption of the data and clock lines when I2C devices are plugged into a live backplane, and the ISL33002 adds level translation f

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ISL33002IRT2Z-T - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - L8.3x3A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
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ISL33002IRT2Z-T - Renesas Electronics  - 3D model - Small Outline No-lead - L8.3x3A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
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ISL33002IRT2Z-T Details

  • Manufacturer Part Number:

    ISL33002IRT2Z-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TDFN

  • Package Description:

    HVSON,

  • Pin Count:

    8

  • Manufacturer Package Code:

    L8.3X3H

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-13

  • Manufacturer:

    Renesas Electronics Corporation

  • Interface IC Type:

    BUS BUFFERS

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ISL33002IRT2Z-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL33002 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence, which is to apply VCC first, followed by VDD. Also, ensure that the EN pin is high during power-up and that the input voltage is within the recommended range. Finally, allow the device to settle for at least 10ms before applying a clock signal.
  • The ISL33002 can support clock frequencies up to 100MHz, but the maximum frequency may vary depending on the specific application and operating conditions. It's recommended to consult the datasheet and application notes for more information on clock frequency limitations.
  • Thermal management is critical for the ISL33002, especially in high-power applications. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Also, follow the recommended thermal design guidelines and thermal resistance calculations to ensure the device operates within its specified temperature range.
  • To protect the ISL33002 from electrostatic discharge (ESD), follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the device in an ESD-protected package. Additionally, consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to the PCB design.

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