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ISL33002IRTZ-T - Renesas Electronics

Description: The ISL33002 two-channel bus buffer provides the buffering necessary to extend the bus capacitance beyond the 400pF maximum specified by the I2C specification. In addition, the ISL33002 features rise time accelerator circuitry to reduce power consumption from passive bus pull-up resistors and improve data-rate performance. The device also includes hot-swap circuitry to prevent corruption of the data and clock lines when I2C devices are plugged into a live backplane, and the ISL33002 adds level translation f

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ISL33002IRTZ-T - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - L8.3x3A
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ISL33002IRTZ-T - Renesas Electronics  - 3D model - Small Outline No-lead - L8.3x3A
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ISL33002IRTZ-T Details

  • Manufacturer Part Number:

    ISL33002IRTZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TDFN

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    L8.3X3A

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-10-13

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Interface IC Type:

    BUS BUFFERS

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ISL33002IRTZ-T Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the device operates within the specified temperature range, it's essential to provide adequate heat sinking, especially in high-power applications. This can be achieved by using a heat sink or a thermal pad, and ensuring good airflow around the device.
  • The recommended input capacitor value is typically in the range of 1uF to 10uF, and it's recommended to use a low-ESR ceramic capacitor, such as an X5R or X7R type, to minimize power losses and ensure stable operation.
  • During power-up, the enable pin (EN) should be held low until the input voltage has reached the minimum operating voltage. During power-down, the enable pin should be held low until the input voltage has dropped below the minimum operating voltage. This ensures that the device is properly shut down and avoids any potential damage.
  • The recommended output capacitor value is typically in the range of 1uF to 10uF, and it's recommended to use a low-ESR ceramic capacitor, such as an X5R or X7R type, to minimize power losses and ensure stable operation. The output capacitor should be placed close to the device's output pin to minimize parasitic inductance.

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