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ISL33003IUZ - Renesas Electronics

Description: The ISL33003 two-channel bus buffer provides the buffering necessary to extend the bus capacitance beyond the 400pF maximum specified by the I2C specification. In addition, the ISL33003 features rise time accelerator circuitry to reduce power consumption from passive bus pull-up resistors and improve data-rate performance. The device also includes hot-swap circuitry to prevent corruption of the data and clock lines when I2C devices are plugged into a live backplane, and the ISL33003 adds level translation f

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ISL33003IUZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.118
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ISL33003IUZ - Renesas Electronics  - 3D model - Small Outline Packages - M8.118
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ISL33003IUZ Details

  • Manufacturer Part Number:

    ISL33003IUZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.118

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-13

  • Manufacturer:

    Renesas Electronics Corporation

  • Interface IC Type:

    BUS BUFFERS

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ISL33003IUZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL33003IUZ involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and initialization of the ISL33003IUZ, make sure to follow the recommended power-up sequence, which involves applying the power supply voltage (VCC) before the input voltage (VIN). Also, ensure that the EN pin is pulled high to enable the device.
  • The ISL33003IUZ has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as using a thermal pad or a heat sink, and to keep the device away from heat sources. Additionally, ensure that the device is operated within the recommended operating temperature range of -40°C to 125°C.
  • To troubleshoot issues with the ISL33003IUZ, start by verifying the input voltage and current, and checking the output voltage and current. Check for any signs of overheating, and ensure that the device is properly powered and initialized. Also, review the PCB layout and ensure that it meets the recommended layout guidelines.
  • Yes, the ISL33003IUZ is a high-frequency device, and as such, it requires proper EMI/EMC design considerations. Ensure that the PCB layout is designed to minimize radiation and susceptibility, and that proper shielding and filtering are used to reduce EMI emissions.

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ISL33003IUZ Overview

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