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ISL43240IRZ - Renesas Electronics

Description: The Intersil ISL43240 device is a CMOS, precision, quad SPDT analog switch designed to operate from a single +2V to +12V supply or from a ±2V to ±6V supply. Targeted applications include battery powered equipment that benefit from the devices’ low power consumption (5µW), low leakage currents (5nA max), and fast switching speeds (tON = 52ns, tOFF = 40ns). A 5Ω maximum rON flatness ensures signal fidelity, while channel-to-channel mismatch is guaranteed to be less than 2Ω. The ISL43240 is a quad single-pole/

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PCB Footprints
ISL43240IRZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L20.4x4
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ISL43240IRZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - L20.4x4
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ISL43240IRZ Details

  • Manufacturer Part Number:

    ISL43240IRZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    QFN-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    L20.4X4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-10-31

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-PQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -6 V

  • Neg Supply Voltage-Min (Vsup):

    -2 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    20

  • Off-state Isolation-Nom:

    71 dB

  • On-state Resistance Match-Nom:

    0.5 Ω

  • On-state Resistance-Max (Ron):

    25 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.03 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    55 ns

  • Switch-on Time-Max:

    75 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ISL43240IRZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL43240IRZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The ISL43240IRZ requires a single 3.3V or 5V power supply. It's recommended to power the IC through a low-dropout regulator (LDO) to ensure a clean and stable power supply. The power sequencing requirement is to power up the VCC pin before the EN pin.
  • The ISL43240IRZ can support data rates up to 100 Mbps, making it suitable for high-speed applications such as USB, HDMI, and SATA.
  • The ISL43240IRZ can be configured for different applications by adjusting the external resistors and capacitors. For example, for USB applications, a 1.5kΩ resistor is required between the VBUS pin and the VCC pin, while for HDMI applications, a 50Ω resistor is required between the HDMI_TXP pin and the HDMI_TXN pin.
  • The ISL43240IRZ has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the IC temperature below 125°C. This can be achieved by using a heat sink, improving air flow, and reducing the power consumption of the IC.

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ISL43240IRZ Overview

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