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ISL54220IUZ - Renesas Electronics

Description: The ISL54220 is a single supply dual 2:1 multiplexer that can operate from a single 2.7V to 5.5V supply. It contains two Single Pole/Double Throw (SPDT) switches configured as a DPDT. The part was designed for switching or routing of USB High-Speed signals and/or USB Full-Speed signals in portable battery-powered products. The 6Ω switches can swing rail-to-rail and were specifically designed to pass USB Full-Speed data signals that range from 0V to 3.3V and USB High-Speed data signals that range from 0V to

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ISL54220IUZ - Renesas Electronics - PCB symbol
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PCB Footprints
ISL54220IUZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M10.118 (JEDEC MO-187BA) 10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
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ISL54220IUZ - Renesas Electronics - 3D model - Small Outline Packages - M10.118 (JEDEC MO-187BA) 10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
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ISL54220IUZ Details

  • Manufacturer Part Number:

    ISL54220IUZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    M10.118

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    32 dB

  • On-state Resistance Match-Nom:

    0.117 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.04 A

  • Supply Current-Max (Isup):

    0.012 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ISL54220IUZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a common mode filter and a shielded cable for the USB interface.
  • Ensure a stable power supply voltage is applied to the VCC pin before configuring the device. Use a pull-up resistor on the EN pin to ensure a high logic level during startup. Initialize the device by writing to the control registers in the correct sequence.
  • Choose resistors with a tolerance of 1% or better and capacitors with a low ESR. Ensure the capacitors are rated for the maximum voltage and current of the application. Use a capacitor with a value of 10uF or greater for the VCC bypass capacitor.
  • Use a logic analyzer or oscilloscope to monitor the digital signals and verify the device is receiving the correct control signals. Check the power supply voltage and ensure it is within the recommended range. Verify the external components are correctly selected and connected.
  • The device has a maximum junction temperature of 150°C. Ensure good thermal conductivity between the device and the PCB. Use a thermal pad or heat sink if necessary. Reduce power consumption and minimize self-heating by optimizing the device configuration and reducing switching frequency.

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ISL54220IUZ Overview

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