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ISL54227IRTZ-T - Renesas Electronics

Description: The Intersil ISL54227 is a single supply, dual SPST (Single Pole/Single Throw) switch that is configured as a DPST. It can operate from a single 2. 7V to 5. 25V supply. The part was designed for switching or isolating a USB high-speed source or a USB high-speed and full-speed source in portable battery powered products. The 3. 5ΩSPST switches were specifically designed to pass USB full speed and USB high speed data signals. They have high bandwidth and low capacitance to pass USB high speed data signals wit

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ISL54227IRTZ-T - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - 10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
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ISL54227IRTZ-T - Renesas Electronics  - 3D model - Small Outline No-lead - 10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
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ISL54227IRTZ-T Details

  • Manufacturer Part Number:

    ISL54227IRTZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TDFN

  • Package Description:

    TDFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    L10.3X3A

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-10-18

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    DPST

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    23 dB

  • On-state Resistance Match-Nom:

    0.2 Ω

  • On-state Resistance-Max (Ron):

    17 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.85 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ISL54227IRTZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL54227IRTZ-T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the battery. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and to minimize the length of the traces between the device and the battery.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence in the datasheet, and make sure to tie the EN pin high to enable the device. Also, configure the device's registers according to the application requirements, and verify the configuration using the device's status registers.
  • The ISL54227IRTZ-T has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as a thermal pad or a heat sink, and to keep the device away from heat sources. Additionally, follow the recommended PCB layout and thermal design guidelines to minimize thermal resistance.
  • To troubleshoot issues, start by verifying the power supply and configuration registers. Use a logic analyzer or oscilloscope to monitor the device's signals and verify that they are within the specified ranges. Check the device's status registers for error flags, and consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, the ISL54227IRTZ-T is a sensitive device and requires proper ESD protection during handling and assembly. Follow standard ESD protection procedures, such as using an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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