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ISL55001IBZ - Renesas Electronics

Description: The ISL55001 is a high speed, low power, low cost monolithic operational amplifier. The ISL55001 is unity-gain stable and features a 300V/µs slew rate and 220MHz bandwidth while requiring only 9mA of supply current. The power supply operating range of the ISL55001 is from ±15V down to ±2. 5V. For single-supply operation, the ISL55001 operates from 30V down to 5V. The ISL55001 also features an extremely wide output voltage swing of -12. 75V/+13. 4V with VS = ±15V and RL = 1kΩ. At a gain of +1, the ISL55001 h

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ISL55001IBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - SOIC_8--
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ISL55001IBZ Details

  • Manufacturer Part Number:

    ISL55001IBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOICN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15E

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-24

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    3.5 µA

  • Bias Current-Max (IIB) @25C:

    3.5 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    250 V/us

  • Slew Rate-Nom:

    280 V/us

  • Supply Current-Max:

    9.25 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    70000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3.9 mm

ISL55001IBZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL55001IBZ involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a separate analog and digital ground plane to reduce noise coupling.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, the output capacitor should be selected based on the specific application requirements, and the input capacitor should be chosen to ensure a stable input impedance. It's also crucial to consider the power supply rejection ratio (PSRR) and the output voltage noise tolerance.
  • The ISL55001IBZ has a thermal shutdown feature that activates when the junction temperature exceeds 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking and airflow. The device's thermal resistance (θJA) is 45°C/W, and the maximum allowed junction temperature is 150°C.
  • To troubleshoot issues with the ISL55001IBZ, start by verifying the input voltage, output voltage, and output current. Check for any signs of overheating, and ensure that the device is properly soldered and connected. Use an oscilloscope to check for any unusual voltage or current waveforms, and consult the datasheet for specific troubleshooting guidelines.
  • To minimize EMI and EMC issues, it's essential to follow proper PCB layout and design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. Additionally, ensure that the device is properly decoupled, and consider using EMI filters or common-mode chokes to reduce emissions.

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ISL55001IBZ Overview

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