Part Image

ISL58303DRTZ - Renesas Electronics

Description: IC LASER DRVR 3CHAN 24TQFN

Download ISL58303DRTZ Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
ISL58303DRTZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L24.4x4E 24 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
click to zoom
3D Models
ISL58303DRTZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - L24.4x4E 24 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
click to zoom

ISL58303DRTZ Details

  • Manufacturer Part Number:

    ISL58303DRTZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFN

  • Package Description:

    4 X 4 MM, TQFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    L24.4X4E

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC24(UNSPEC)

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ISL58303DRTZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a common mode filter and a ferrite bead to reduce EMI.
  • Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, ensure the device is not exposed to extreme temperatures during storage or transportation.
  • Power up the device in the following sequence: VCC, AVCC, and then DVCC. Ensure that the power supplies are stable and within the recommended voltage range before applying the input signals.
  • Check the ADC clock frequency, ensure the input signal is within the recommended range, and verify the ADC configuration registers. Also, check for noise and interference on the input signal and ensure the device is operating within the specified temperature range.
  • Use a common mode filter, a ferrite bead, and a shielded enclosure to reduce EMI. Ensure good PCB layout practices, such as keeping the analog and digital grounds separate, and using a solid ground plane.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

ISL58303DRTZ Overview

Use the download button to access the ISL58303DRTZ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ISL58, or try a keyword search, such as Other Interface ICs

Parts related to ISL58303DRTZ

Showing 0 results