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ISL6115CBZA - Renesas Electronics

Description: This family of fully featured hot swap power controllers targets applications in the +2. 5V to +12V range. The ISL6115 is for +12V control, the ISL6116 for +5V, the ISL6117 for +3. 3V and the ISL6120 for +2. 5V control applications. Each has a hard wired undervoltage (UV) monitoring and reporting threshold level approximately 80% of the aforementioned voltage. The ISL6115 has an integrated charge pump allowing control of up to +16V rails using an external N-Channel MOSFET whereas the other devices utilize t

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ISL6115CBZA - Renesas Electronics - PCB symbol
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ISL6115CBZA - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - (8 LD SOIC)
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ISL6115CBZA - Renesas Electronics - 3D model - Small Outline Packages - (8 LD SOIC)
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ISL6115CBZA Details

  • Manufacturer Part Number:

    ISL6115CBZA

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    1

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    13.8 V

  • Supply Voltage-Min (Vsup):

    10.2 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

ISL6115CBZA Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short, wide traces for the high-current paths.
  • Monitor the input voltage, output current, and junction temperature to ensure they are within the specified limits. Use thermal design and layout techniques to minimize thermal resistance and ensure adequate heat sinking.
  • Choose capacitors with low ESR, high ripple current rating, and suitable voltage ratings. Ensure the capacitors are placed close to the IC and connected with short, wide traces to minimize inductance and resistance.
  • Use an oscilloscope to monitor the input and output waveforms, and check for signs of oscillation or instability. Verify the PCB layout and component selection meet the recommended guidelines, and ensure the input and output capacitors are properly selected and placed.
  • Use a thermal interface material (TIM) between the IC and the heat sink, and ensure good thermal contact. Choose a heat sink with a high thermal conductivity and a sufficient surface area to dissipate the heat generated by the IC.

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ISL6115CBZA Overview

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