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ISL62883IRTZ - Renesas Electronics

Description: The ISL62883 is a multiphase PWM buck regulator for microprocessor core power supply. The multiphase buck converter uses interleaved phase to reduce the total output voltage ripple with each phase carrying a portion of the total load current, providing better system performance, superior thermal management, lower component cost, reduced power dissipation, and smaller implementation area. The ISL62883 uses two integrated gate drivers and an external gate driver to provide a complete solution. The PWM modulat

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PCB Footprints
ISL62883IRTZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - TQFN-40
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3D Models
ISL62883IRTZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - TQFN-40
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ISL62883IRTZ Details

  • Manufacturer Part Number:

    ISL62883IRTZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    L40.5X5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-11-15

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    BATTERY VOLTAGE=(4.5-25 VOLT)

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    4.6 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    300 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

ISL62883IRTZ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance can be found in the ISL62883IRTZ evaluation board user manual or by contacting Renesas Electronics Corporation's technical support. A good layout should minimize noise, ensure proper thermal dissipation, and follow the datasheet's guidelines for component placement and routing.
  • To troubleshoot issues with the ISL62883IRTZ, start by reviewing the datasheet and application notes to ensure proper configuration and operation. Check for proper power supply, clock signal, and input/output connections. Use oscilloscopes and logic analyzers to debug signal waveforms and timing. If issues persist, contact Renesas Electronics Corporation's technical support for further assistance.
  • The ISL62883IRTZ has a maximum junction temperature of 150°C. To ensure proper thermal management, use a heat sink with a thermal resistance of less than 10°C/W, and ensure good airflow around the device. Follow the datasheet's guidelines for thermal pad connection and PCB layout to minimize thermal resistance.
  • The ISL62883IRTZ is a commercial-grade device, but Renesas Electronics Corporation offers automotive-grade and high-reliability versions of the device. Contact Renesas Electronics Corporation's sales or technical support to discuss specific requirements and availability of these versions.
  • To ensure EMC with the ISL62883IRTZ, follow the datasheet's guidelines for PCB layout, component selection, and shielding. Use proper filtering and decoupling techniques to minimize electromagnetic interference (EMI). Ensure that the device is properly grounded and that all cables and connectors are properly shielded.

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