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ISL6363CRTZ - Renesas Electronics

Description: Fully compliant with VR12™ specifications, the ISL6363 provides a complete solution for microprocessor core and graphics power supplies. It provides two Voltage Regulators (VRs) with three integrated gate drivers. The first output (VR1) can be configured as a 4, 3, 2 or 1-phase VR while the second output (VR2) is a 1-phase VR. The two VRs share a serial control bus to communicate with the CPU and achieve lower cost and smaller board area compared with a two-chip approach. Based on Renesas' Robust Ripple Reg

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PCB Footprints
ISL6363CRTZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L48.6x6
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ISL6363CRTZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - L48.6x6
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ISL6363CRTZ Details

  • Manufacturer Part Number:

    ISL6363CRTZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    L48.6X6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-12-05

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    O/P VOLTAGE RANGE 0.25V TO 1.52V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    20 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    300 kHz

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

ISL6363CRTZ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance involves keeping the power stage components (e.g., FETs, inductors, and capacitors) close together, using a solid ground plane, and minimizing the length of the high-current paths. Additionally, it's essential to follow the datasheet's guidelines for component placement and routing.
  • To optimize the compensation network, you'll need to consider factors such as the output voltage, output current, and switching frequency. A good starting point is to use the datasheet's recommended compensation values and then adjust them based on your specific application's requirements. You may also need to use simulation tools or empirical methods to fine-tune the compensation network.
  • The ISL6363CRTZ has a maximum junction temperature of 150°C. To ensure reliable operation, you should ensure that the device is properly heatsinked, and the PCB is designed to dissipate heat efficiently. You should also consider the thermal resistance of the package and the PCB, as well as the ambient temperature of the operating environment.
  • To troubleshoot issues with the ISL6363CRTZ, start by checking the basics, such as the power supply, input voltage, and output voltage. Use an oscilloscope to monitor the waveforms and look for signs of oscillation or instability. Check the datasheet for troubleshooting guidelines and application notes, and consider using simulation tools or seeking support from Renesas Electronics Corporation or a qualified engineer.
  • The ISL6363CRTZ is designed to meet EMI and EMC regulatory requirements, but you'll still need to consider the overall system design and layout to ensure compliance. This includes using proper shielding, filtering, and grounding techniques, as well as following the datasheet's guidelines for EMI and EMC. You may also need to perform EMI and EMC testing to ensure compliance with regulatory requirements.

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