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ISL6363IRTZ - Renesas Electronics

Description: Fully compliant with VR12™ specifications, the ISL6363 provides a complete solution for microprocessor core and graphics power supplies. It provides two Voltage Regulators (VRs) with three integrated gate drivers. The first output (VR1) can be configured as a 4, 3, 2 or 1-phase VR while the second output (VR2) is a 1-phase VR. The two VRs share a serial control bus to communicate with the CPU and achieve lower cost and smaller board area compared with a two-chip approach. Based on Renesas' Robust Ripple Reg

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PCB Footprints
ISL6363IRTZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48 Ld 6x6 TQFN-
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3D Models
ISL6363IRTZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - 48 Ld 6x6 TQFN-
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ISL6363IRTZ Details

  • Manufacturer Part Number:

    ISL6363IRTZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    L48.6X6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-12-05

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    O/P VOLTAGE RANGE 0.25V TO 1.52V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    20 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    300 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

ISL6363IRTZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL6363IRTZ involves keeping the high-current paths short and wide, using a solid ground plane, and placing the input and output capacitors close to the IC. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • Choose input capacitors with low ESR and high ripple current rating. Output capacitors should have low ESR and be able to handle the output current. A good starting point is to use 10uF to 22uF ceramic capacitors for both input and output.
  • A good thermal design for the ISL6363IRTZ involves using a heat sink with a thermal resistance of less than 10°C/W, and ensuring good airflow around the IC. The PCB should also have a solid ground plane to help dissipate heat.
  • To troubleshoot issues with the ISL6363IRTZ, start by checking the input voltage, output voltage, and current. Verify that the input and output capacitors are properly sized and that the PCB layout is correct. Check for signs of overheating, such as excessive temperature or thermal shutdown. Consult the datasheet and application notes for more guidance.
  • Yes, the ISL6363IRTZ is qualified for high-reliability and high-temperature applications. However, it's essential to follow the recommended operating conditions, derating, and thermal design guidelines to ensure reliable operation.

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ISL6363IRTZ Overview

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