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ISL6611ACRZ - Renesas Electronics

Description: The ISL6611A utilizes Intersil’s proprietary Phase Doubler scheme to modulate two-phase power trains with single PWM input. It doubles the number of phases that Intersil’s ISL63xx multiphase controllers can support. At the same time, the PWM line can be pulled high to disable the corresponding phase or higher phase(s) when the enable pin (EN_PH) is pulled low. This simplifies the phase shedding implementation. For layout simplicity and improving system performance, the device integrates two 5V drivers (ISL6

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ISL6611ACRZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16 Ld 4x4 QFN-1
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ISL6611ACRZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - 16 Ld 4x4 QFN-1
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ISL6611ACRZ Details

  • Manufacturer Part Number:

    ISL6611ACRZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    L16.4X4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    IT USES PROPRIETARY PHASE DOUBLER SCHEME FOR MODULATION

  • Analog IC - Other Type:

    DUAL SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    PHASE-SHIFT

  • Switching Frequency-Max:

    1000 kHz

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ISL6611ACRZ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the ISL6611ACRZ involves placing the input capacitors close to the VIN pin, using a solid ground plane, and keeping the high-current paths short and wide. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a separate ground plane.
  • The selection of external components for the ISL6611ACRZ depends on the specific application requirements, such as the input voltage, output voltage, and output current. Renesas provides a component selection guide in the datasheet, which can be used to determine the suitable component values. Additionally, online tools and simulation software can be used to aid in the component selection process.
  • The ISL6611ACRZ has an operating temperature range of -40°C to +125°C, with a junction temperature range of -40°C to +150°C. However, the device's performance and reliability may degrade at higher temperatures, so it's recommended to operate the device within a temperature range of -20°C to +100°C for optimal performance.
  • Troubleshooting common issues with the ISL6611ACRZ involves identifying the root cause of the problem, which can be done by checking the input voltage, output voltage, and current, as well as the device's thermal performance. Renesas provides a troubleshooting guide in the datasheet, which can be used to identify and resolve common issues. Additionally, online resources and application notes can provide further guidance.
  • The ISL6611ACRZ is designed to meet EMI and EMC standards, but proper PCB layout and design practices are still required to ensure compliance. This includes using shielding, filtering, and decoupling, as well as following good layout practices such as keeping high-frequency signals away from sensitive analog signals.

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