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ISL68222IRAZ - Renesas Electronics

Description: The ISL68222 is a digital dual output multiphase (X+Y ≤ 5) PWM controller supporting PMBus V1.3/AVSBus interfaces. The controller can be configured to support any phase assignments up to a maximum of five phases across the two outputs (X and Y). For example, 4+1, 3+2, 3+1, 1+1, or a single output operation as a 5+0 configuration is supported. Increased power density and PMBus V1.3 interface support allow the ISL68222 to support any demanding power supply requirement.The ISL68222 uses the proprietary Renesas

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ISL68222IRAZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 40 Lead Thin Quad Flat No-Lead Plastic Package
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ISL68222IRAZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - 40 Lead Thin Quad Flat No-Lead Plastic Package
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ISL68222IRAZ Details

  • Manufacturer Part Number:

    ISL68222IRAZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    L40.5X5D

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2020-10-01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    1

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    3.465 V

  • Input Voltage-Min:

    3.135 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    3.05 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.2SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.75 mm

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    PHASE-SHIFT

  • Switching Frequency-Max:

    2000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

ISL68222IRAZ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance can be found in the ISL68222IRAZ evaluation board user manual or by contacting Renesas' technical support. A good layout should ensure proper thermal management, minimize noise coupling, and optimize signal integrity.
  • Optimizing the compensation network requires understanding the system's transfer function and the desired closed-loop response. Renesas provides a compensation tool and application notes to help with this process. Additionally, consulting with a power management expert or Renesas' technical support can be beneficial.
  • While the datasheet specifies the maximum input voltage, the allowed input voltage ripple is not explicitly stated. As a general guideline, it's recommended to keep the input voltage ripple below 10% of the nominal input voltage to ensure reliable operation. However, this may vary depending on the specific application and system requirements.
  • To ensure the device meets the required EMC standards, follow the recommended PCB layout and design guidelines, use proper shielding and filtering, and consult with Renesas' technical support or an EMC expert. Additionally, perform EMC testing and validation to ensure compliance with the relevant standards.
  • For high-power applications, a robust thermal management strategy is crucial. This includes using a heat sink with a low thermal resistance, ensuring good airflow, and optimizing the PCB layout for thermal dissipation. Consult with Renesas' technical support or a thermal management expert for specific guidance.

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