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ISL78444AVEZ - Renesas Electronics

Description: The ISL78424, ISL78434, and ISL78444 are Automotive Grade (AEC-Q100 Grade 1) high voltage, high frequency, half-bridge NMOS FET drivers for driving the gates of up to 70V half-bridge topologies. The family of half-bridge drivers feature 3A sourcing, 4A sinking peak gate drive current. The ISL78424 and ISL78444 feature a single tri-level PWM input for controlling both gate drivers. The ISL78434 has dual independent inputs for controlling the high-side and low-side driver separately. The ISL78424 and ISL78434

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ISL78444AVEZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M14.173B 14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
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3D Models
ISL78444AVEZ - Renesas Electronics  - 3D model - Small Outline Packages - M14.173B 14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
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ISL78444AVEZ Details

  • Manufacturer Part Number:

    ISL78444AVEZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-EP

  • Package Description:

    HTSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    M14.173B

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    11.9 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.08 µs

  • Turn-on Time:

    0.06 µs

  • Width:

    4.4 mm

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ISL78444AVEZ Overview

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