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ISL8485EIPZ - Renesas Electronics

Description: The ISL8483E and ISL8485E are ESD protected, BiCMOS 5V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. Each driver output/receiver input is protected against ±15kV ESD strikes without latch-up. Unlike competitive devices, this Renesas family is specified for 10% tolerance supplies (4. 5V to 5. 5V). The ISL8483E uses slew rate limited drivers that reduce EMI and minimize reflections from improperly terminated transmission lines or unterminated stubs in

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ISL8485EIPZ - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - E8.3
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ISL8485EIPZ - Renesas Electronics  - 3D model - Dual-In-Line Packages - E8.3
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ISL8485EIPZ Details

  • Manufacturer Part Number:

    ISL8485EIPZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PDIP

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    E8.3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2018-01-23

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.585 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Receive Delay-Max:

    150 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    5.33 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    50 ns

  • Width:

    7.62 mm

ISL8485EIPZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in the ISL8485EIPZ evaluation board user manual, which includes guidelines for component placement, routing, and thermal management. It's essential to follow these guidelines to minimize noise, ensure signal integrity, and prevent thermal issues.
  • The ISL8485EIPZ is a versatile transceiver that can be configured for different applications using external resistors and capacitors. Renesas provides application notes and design guides that provide detailed configuration information for specific applications, including RS-485 and RS-422.
  • The maximum cable length supported by the ISL8485EIPZ depends on the specific application, data rate, and cable characteristics. As a general rule, the maximum cable length is limited by the signal attenuation and distortion caused by the cable. Renesas recommends using a cable length of up to 4000 feet (1219 meters) for RS-485 applications, but this can be extended using repeaters or signal conditioners.
  • The ISL8485EIPZ has a high common-mode voltage range of up to ±15V, making it suitable for industrial and harsh environment applications. However, system designers must ensure that the common-mode voltage is within the specified range to prevent damage to the device. Additionally, the common-mode voltage can affect the signal quality and noise immunity, so it's essential to consider it during system design.
  • The ISL8485EIPZ has a maximum junction temperature of 150°C, and it's essential to ensure that the device operates within the specified temperature range to prevent thermal shutdown or damage. System designers should consider thermal management techniques such as heat sinking, thermal pads, and airflow to keep the device temperature within the specified range.

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ISL8485EIPZ Overview

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