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ISL9R3060G2 - onsemi

Description: Max Forward Voltage, VF = 2.4V (@ TC = 25°C); Avalanche Energy Rated; 600V Reverse Voltage and High Reliability; Stealth recovery Trr = 36ns (@IF= 30A); RoHS compliant

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PCB Footprints
ISL9R3060G2 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−247−2LD CASE 340CL ISSUE A
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ISL9R3060G2 - onsemi  - 3D model - Transistor Outline, Vertical - TO−247−2LD CASE 340CL ISSUE A
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ISL9R3060G2 Details

  • Manufacturer Part Number:

    ISL9R3060G2

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-247-2

  • Manufacturer Package Code:

    340CL

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, SNUBBER DIODE

  • Application:

    FAST SOFT RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.1 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    325 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.045 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

ISL9R3060G2 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure good thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the junction temperature (TJ) and adjust the design accordingly.
  • The maximum allowed voltage on the input pins is 6V, exceeding this may cause damage to the device.
  • Yes, the ISL9R3060G2 is designed for high-reliability applications. It has undergone rigorous testing and meets the requirements for automotive and industrial applications.
  • Check the power supply, input signals, and output loads. Verify that the device is operated within the recommended conditions. Use oscilloscopes and logic analyzers to debug the issue.

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ISL9R3060G2 Overview

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